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Osmium Oxide Sputtering Target

CAS #: 12036-02-1
Linear Formula:
OsO2
MDL Number
MFCD00011150
EC No.:
244-058-7

ORDER

Product Product Code ORDER SAFETY DATA Technical data
(3N) 99.9% Osmium Oxide Sputtering Target OS-OX-03ST SDS > Data Sheet >
(4N) 99.99% Osmium Oxide Sputtering Target OS-OX-04ST SDS > Data Sheet >
(5N) 99.999% Osmium Oxide Sputtering Target OS-OX-05ST SDS > Data Sheet >
WHOLESALE/SKU 0000-742-7085

Osmium Oxide Sputtering Target Properties (Theoretical)

Compound Formula OsO2
Molecular Weight 222.229
Appearance Black or Yellow-Brown Crystalline Solid
Melting Point 500 °C (932 °F) (decomposes)
Boiling Point N/A
Density 11400 kg/m-3
Solubility in H2O N/A
Exact Mass 255.941 g/mol
Monoisotopic Mass 255.941 g/mol
Charge 255.941158 Da

Osmium Oxide Sputtering Target Health & Safety Information

Signal Word Danger
Hazard Statements H301
Hazard Codes N/A
Precautionary Statements P264-P270-P301+P310-P321-P405-P501
Flash Point Not applicable
Risk Codes N/A
Safety Statements N/A
RTECS Number N/A
Transport Information NONH
WGK Germany NONH
GHS Pictogram
Image
Skull and Crossbones - GHS06

About Osmium Oxide Sputtering Target

Oxide IonAmerican Elements specializes in producing high purity Osmium oxide sputtering targets with the highest possible density High Purity (99.99%) Metallic Sputtering Targetand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devises as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Research sized targets are also produced as well as custom sizes and alloys. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics. We also produce Osmium Oxide as rods, powder and plates. Oxide compounds are not conductive to electricity. However, certain perovskite structured oxides are electronically conductive finding application in the cathode of solid oxide fuel cells and oxygen generation systems. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Other shapes are available by request.

Synonyms

Osmic acid, Osmium Tetroxide, Perosmic oxide, Osmium(VIII)-oxide, tetraoxoosmium, Perosmic acid anhydride, Tetraketoosmium

Chemical Identifiers

Linear Formula OsO2
Pubchem CID 24884370
MDL Number MFCD00011150
EC No. 244-058-7
IUPAC Name tetraoxoosmium
Beilstein/Reaxys No. N/A
SMILES O=[Os](=O)(=O)=O
InchI Identifier InChI=1S/4O.Os
InchI Key VUVGYHUDAICLFK-UHFFFAOYSA-N
Chemical Formula
Molecular Weight
Standard InchI
Appearance
Melting Point
Boiling Point
Density

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Osmium products. Osmium (atomic symbol: Os, atomic number: 76) is a Block D, Group 8, Period 6 element with an atomic weight of 190.23. Osmium Bohr ModelThe number of electrons in each of osmium's shells is [2, 8, 18, 32, 14, 2] and its electron configuration is [Xe] 4f14 5d6 6s2. The osmium atom has a radius of 135 pm and a Van der Waals radius of 216 pm. Osmium was discovered and first isolated by Smithson Tennant in 1803. Elemental OsmiumIn its elemental form, osmium has a silvery blue cast apperance. Osmium has the highest melting point and the lowest vapor pressure of any of the platinum group of metals it is also the densest naturally ocurring element. Osmium is the least abundant stable element in the earth's crust. It is found in the alloys osmiridium and iridiosmium and as a free element. The origin of the name Osmium comes from the Greek word osme, meaning a smell or odor.